The 2026 Open Data Center Conference and inaugural Computing Expo (2026ODX) kicked off in Beijing on September 2. At the opening ceremony, Chindata was named a 2026ODX Pioneer Enterprise for its innovative business model, technological breakthroughs and expanding presence across China's national computing infrastructure hubs.

The award is the only honor at this year's conference presented specifically to an enterprise. It recognizes companies that are driving innovation and helping shape the next stage of AI infrastructure development.
Since its launch in 2014, the Open Data Center Conference has become one of China's leading industry and technology events for computing infrastructure. More than 300 industry achievements have been unveiled at the conference over the years, which has also played a role in advancing technology and collaboration across the sector. This year, the event was expanded into the Open Data Center Conference and Inaugural Computing Expo, covering topics including computing networks, liquid cooling, power and computing integration, intelligent operations and infrastructure for AI models. It also introduced a series of awards to recognize companies making notable contributions to technology innovation and commercial deployment.
For Chindata, 2026 marks a new stage of development. The company is drawing on HEC Group's industrial and supply chain capabilities to strengthen its business across the AI infrastructure sector.
Chindata is developing an integrated model that connects energy, computing and industrial production. By combining vertical integration with collaboration across the value chain, the company is creating advantages in cost, technology and service, and turning its strategy into projects on the ground.
The company is also advancing the commercialization of new power and cooling technologies. At Chindata's Sangyuan Cloud Computing Campus in Zhangjiakou CIty, Hebei Province, the industry's first commercial intelligent DC power system based on a solid state transformer (SST) has entered operation. The system achieves power conversion efficiency of up to 98.5% and requires more than 50% less space than a conventional power distribution system.
At a technical forum during the conference, a Chindata technology specialist shared insights into the development of liquid cooling for AI data centers and the company's experience in deploying the technology. Chindata is working with HEC Group on an integrated solution covering liquid cooling materials, equipment and AI data centers, creating a closed loop from materials and equipment through to deployment. The company is also exploring configurations and intelligent control strategies for liquid cooling systems designed for high density GPU deployments, with the goal of developing a more effective way to evaluate energy efficiency based on actual computing performance.
Chindata is also expanding its presence across the national integrated computing network and its designated hubs. In Ulanqab, Inner Mongolia, the company is developing China's first GW scale vertically integrated industrial demonstration zone with direct access to renewable power.
As AI moves toward large scale deployment, demand for high performance computing infrastructure is growing rapidly. Chindata is building the infrastructure to support this next stage of AI development through the expansion of its computing campuses and continued investment in technology.
The company will continue to bring new technologies into commercial use, while working with industry partners to turn individual innovations into scalable solutions and broader ecosystem capabilities.
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